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              時間:2017-02-27      來源:蘇州迪森特      關鍵詞:蘇州迪森特      瀏覽量:984



              The term ?co-planarity“ describes theproper seating of the tips of fine-pitch device leads on the copper pads on aPCB prior to solder process. The co-planarity is a critical dimension for thequality of the soldered joints, because no reliable and correct soldering canbe done if there is a gap between the lead and the pad. In state of the artautomatic assembly machines the co-planarity of components is measured duringthe assembling process. The component to be measured is passed over a triangulationdisplacement sensor which has a laser beam that scans the row of pins.